JPS5128754A - - Google Patents

Info

Publication number
JPS5128754A
JPS5128754A JP10092074A JP10092074A JPS5128754A JP S5128754 A JPS5128754 A JP S5128754A JP 10092074 A JP10092074 A JP 10092074A JP 10092074 A JP10092074 A JP 10092074A JP S5128754 A JPS5128754 A JP S5128754A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10092074A
Other languages
Japanese (ja)
Other versions
JPS6112373B2 (en]
Inventor
Tsutomu Shimata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP49100920A priority Critical patent/JPS6112373B2/ja
Priority to US05/608,733 priority patent/US4016855A/en
Publication of JPS5128754A publication Critical patent/JPS5128754A/ja
Publication of JPS6112373B2 publication Critical patent/JPS6112373B2/ja
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/02—Devices for lubricating or cooling circular saw blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP49100920A 1974-09-04 1974-09-04 Expired JPS6112373B2 (en])

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP49100920A JPS6112373B2 (en]) 1974-09-04 1974-09-04
US05/608,733 US4016855A (en) 1974-09-04 1975-08-28 Grinding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49100920A JPS6112373B2 (en]) 1974-09-04 1974-09-04

Publications (2)

Publication Number Publication Date
JPS5128754A true JPS5128754A (en]) 1976-03-11
JPS6112373B2 JPS6112373B2 (en]) 1986-04-08

Family

ID=14286769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49100920A Expired JPS6112373B2 (en]) 1974-09-04 1974-09-04

Country Status (2)

Country Link
US (1) US4016855A (en])
JP (1) JPS6112373B2 (en])

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55112761A (en) * 1979-02-20 1980-08-30 Disco Abrasive Sys Ltd Dry type cutting method
JPS599926A (ja) * 1982-07-08 1984-01-19 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS62144145U (en]) * 1986-03-06 1987-09-11
JP2007188974A (ja) * 2006-01-11 2007-07-26 Tokyo Seimitsu Co Ltd ダイシング装置

Families Citing this family (58)

* Cited by examiner, † Cited by third party
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DE2730130C2 (de) * 1976-09-14 1987-11-12 Mitsubishi Denki K.K., Tokyo Verfahren zum Herstellen von Halbleiterbauelementen
US4091580A (en) * 1977-06-29 1978-05-30 Timex Corporation Process for holding and cutting sheet glass
US4279102A (en) * 1978-07-24 1981-07-21 Magnetic Peripherals Inc. Method of manufacturing narrow track ferrite head cores
CH635769A5 (fr) * 1980-03-10 1983-04-29 Far Fab Assortiments Reunies Installation pour le sciage de plaques et dispositif de manutention pour une telle installation.
US4501258A (en) * 1982-10-04 1985-02-26 Texas Instruments Incorporated Kerf loss reduction in internal diameter sawing
US4502459A (en) * 1982-10-04 1985-03-05 Texas Instruments Incorporated Control of internal diameter saw blade tension in situ
JPS59122209U (ja) * 1983-02-07 1984-08-17 株式会社デイスコ 切断機
US4564000A (en) * 1984-07-06 1986-01-14 The United States Of America As Represented By The Secretary Of The Army Precision cutting of millimeter wave ferrite materials
US4914866A (en) * 1984-11-29 1990-04-10 American Telephone And Telegraph Co. Apparatus for adjusting optical fiber connector components
US4738055A (en) * 1984-11-29 1988-04-19 American Telephone And Telegraph Company, At&T Bell Laboratories Methods of adjusting optical fiber connector components
US4976072A (en) * 1989-03-10 1990-12-11 Hicks Thomas W Fluid directing method and apparatus for aiding the shaping, polishing and smoothing of work piece by sanding
US5143854A (en) * 1989-06-07 1992-09-01 Affymax Technologies N.V. Large scale photolithographic solid phase synthesis of polypeptides and receptor binding screening thereof
US5547839A (en) * 1989-06-07 1996-08-20 Affymax Technologies N.V. Sequencing of surface immobilized polymers utilizing microflourescence detection
DE69132843T2 (de) * 1990-12-06 2002-09-12 Affymetrix, Inc. (N.D.Ges.D.Staates Delaware) Identifizierung von Nukleinsäuren in Proben
US6943034B1 (en) 1991-11-22 2005-09-13 Affymetrix, Inc. Combinatorial strategies for polymer synthesis
US6864101B1 (en) 1991-11-22 2005-03-08 Affymetrix, Inc. Combinatorial strategies for polymer synthesis
US6741344B1 (en) * 1994-02-10 2004-05-25 Affymetrix, Inc. Method and apparatus for detection of fluorescently labeled materials
US6090555A (en) * 1997-12-11 2000-07-18 Affymetrix, Inc. Scanned image alignment systems and methods
US5631734A (en) * 1994-02-10 1997-05-20 Affymetrix, Inc. Method and apparatus for detection of fluorescently labeled materials
US20030017081A1 (en) * 1994-02-10 2003-01-23 Affymetrix, Inc. Method and apparatus for imaging a sample on a device
EP0695941B1 (en) * 1994-06-08 2002-07-31 Affymetrix, Inc. Method and apparatus for packaging a chip
US6287850B1 (en) * 1995-06-07 2001-09-11 Affymetrix, Inc. Bioarray chip reaction apparatus and its manufacture
JP3566417B2 (ja) * 1994-10-31 2004-09-15 株式会社荏原製作所 ポリッシング装置
US5959098A (en) 1996-04-17 1999-09-28 Affymetrix, Inc. Substrate preparation process
US5599695A (en) * 1995-02-27 1997-02-04 Affymetrix, Inc. Printing molecular library arrays using deprotection agents solely in the vapor phase
US6239273B1 (en) 1995-02-27 2001-05-29 Affymetrix, Inc. Printing molecular library arrays
US6720149B1 (en) * 1995-06-07 2004-04-13 Affymetrix, Inc. Methods for concurrently processing multiple biological chip assays
JP3778594B2 (ja) * 1995-07-18 2006-05-24 株式会社荏原製作所 ドレッシング方法
JPH0955362A (ja) * 1995-08-09 1997-02-25 Cypress Semiconductor Corp スクラッチを減少する集積回路の製造方法
US6706875B1 (en) 1996-04-17 2004-03-16 Affyemtrix, Inc. Substrate preparation process
JP2000512744A (ja) 1996-05-16 2000-09-26 アフィメトリックス，インコーポレイテッド 標識材料を検出するシステムおよび方法
US5832585A (en) * 1996-08-13 1998-11-10 National Semiconductor Corporation Method of separating micro-devices formed on a substrate
US5923995A (en) * 1997-04-18 1999-07-13 National Semiconductor Corporation Methods and apparatuses for singulation of microelectromechanical systems
US6425972B1 (en) * 1997-06-18 2002-07-30 Calipher Technologies Corp. Methods of manufacturing microfabricated substrates
JP3497071B2 (ja) * 1997-11-20 2004-02-16 東芝機械株式会社 輪郭加工方法および加工機械
US5920769A (en) * 1997-12-12 1999-07-06 Micron Technology, Inc. Method and apparatus for processing a planar structure
US5827112A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
US5827111A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
JP3482331B2 (ja) * 1997-12-17 2003-12-22 東芝機械株式会社 仕上げ加工方法
US20040265838A1 (en) * 1998-02-06 2004-12-30 Affymetrix, Inc. Method of manufacturing
US7612020B2 (en) 1998-12-28 2009-11-03 Illumina, Inc. Composite arrays utilizing microspheres with a hybridization chamber
TW440494B (en) * 1999-05-13 2001-06-16 Sumitomo Spec Metals Machining method of rare earth alloy and manufacture of rare earth magnet using it
MY126040A (en) * 1999-06-01 2006-09-29 Neomax Co Ltd Magnet member cutting method and magnet member cutting apparatus.
JP3444536B2 (ja) * 1999-10-25 2003-09-08 松下電器産業株式会社 半導体レーザー素子の製造方法および劈開装置
US6420206B1 (en) 2001-01-30 2002-07-16 Axsun Technologies, Inc. Optical membrane singulation process utilizing backside and frontside protective coating during die saw
US20040241659A1 (en) * 2003-05-30 2004-12-02 Applera Corporation Apparatus and method for hybridization and SPR detection
US20060246576A1 (en) * 2005-04-06 2006-11-02 Affymetrix, Inc. Fluidic system and method for processing biological microarrays in personal instrumentation
US8055098B2 (en) * 2006-01-27 2011-11-08 Affymetrix, Inc. System, method, and product for imaging probe arrays with small feature sizes
US9445025B2 (en) 2006-01-27 2016-09-13 Affymetrix, Inc. System, method, and product for imaging probe arrays with small feature sizes
US20070254255A1 (en) * 2006-03-28 2007-11-01 Neville James E System, apparatus and methods for board cooling
US20080003667A1 (en) * 2006-05-19 2008-01-03 Affymetrix, Inc. Consumable elements for use with fluid processing and detection systems
US7572990B2 (en) * 2007-03-30 2009-08-11 Intermec Ip Corp. Keypad overlay membrane
US8425279B2 (en) * 2008-09-30 2013-04-23 Misubishi Polycrystalline Silicon America Corporation (MIPSA) Apparatus for manufacturing seeds for polycrystalline silicon manufacture
US8602845B2 (en) * 2011-09-23 2013-12-10 United Technologies Corporation Strengthening by machining
US20130217310A1 (en) * 2012-02-21 2013-08-22 Chih-hao Chen Wafer Processing Equipment
JP6417227B2 (ja) 2015-01-27 2018-10-31 株式会社ディスコ 切削ブレード及び切削装置並びにウエーハの加工方法
JP6462422B2 (ja) * 2015-03-03 2019-01-30 株式会社ディスコ 切削装置及びウエーハの加工方法
US20180043504A1 (en) * 2016-08-12 2018-02-15 United Technologies Corporation Machining a cooled region of a body

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1063904A (en) * 1963-07-13 1967-04-05 Waldrich Werkzeugmasch Method and apparatus for cooling machine tools
JPS48104255U (en]) * 1972-03-11 1973-12-05
JPS4917988A (en]) * 1972-06-06 1974-02-16

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2911773A (en) * 1957-06-18 1959-11-10 Itt Method of cutting semiconductive material
US3672099A (en) * 1970-09-03 1972-06-27 Univ California Automatic rock thinsectioning machine
US3831576A (en) * 1971-11-22 1974-08-27 Motorola Inc Machine and method for cutting brittle materials using a reciprocating cutting wire

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1063904A (en) * 1963-07-13 1967-04-05 Waldrich Werkzeugmasch Method and apparatus for cooling machine tools
JPS48104255U (en]) * 1972-03-11 1973-12-05
JPS4917988A (en]) * 1972-06-06 1974-02-16

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55112761A (en) * 1979-02-20 1980-08-30 Disco Abrasive Sys Ltd Dry type cutting method
JPS599926A (ja) * 1982-07-08 1984-01-19 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS62144145U (en]) * 1986-03-06 1987-09-11
JP2007188974A (ja) * 2006-01-11 2007-07-26 Tokyo Seimitsu Co Ltd ダイシング装置

Also Published As

Publication number Publication date
JPS6112373B2 (en]) 1986-04-08
US4016855A (en) 1977-04-12

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